Every year
IC & Sensor Packaging Expo
17-19 February 2027
Semiconductor, IC and Sensor Packaging Technologies Expo
Packaging, Plastic and Rubber Machinery and Technologies Trade Fairs by RX Japan Ltd. — Japan
Let's take a short break
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![Plastic Japan [Nagoya] logo](/assets/logos/catalog/4f/plastic-japan-nagoya-high-performance-plastic-expo--4f257277782139cea6b77d84e2d7af3da6badd469e31be873bb2e832cf4f8324.webp)
