IC & Sensor Packaging Expo
Semiconductor, IC and Sensor Packaging Technologies Expo
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17-19 February 2027 Planned
When and where will IC & Sensor Packaging Expo take place?
IC & Sensor Packaging Expo Semiconductor, IC and Sensor Packaging Technologies Expo will be held on 17-19 February 2027 at Tokyo Big Sight in Japan - Tokyo.
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Fair sectors
Organizer
RX Japan Ltd.Become an Exhibitor
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Annually
23-27 September 2026
International Smart Space Exhibition
Every year
30 September - 2 October 2026
International Electronic Display and Imaging Technologies Exhibition
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Every year
30 September - 2 October 2026
International Laser and Photonics Technologies Exhibition
Every two years
6-8 October 2026
Electronics Manufacturing Exhibition
Every two years
6-8 October 2026
International Machine Vision and Image Processing Exhibition
Every year
12-15 October 2026
International Battery Technologies, Electric Vehicles, Energy Storage and Batte...
Every year
13-15 October 2026
International Semiconductor, Optoelectronic, Electronic Components and Smart Te...
Every year
13-16 October 2026
International Trade Fair for Components, Assemblies and Electronics Production
Every year
13-15 October 2026
International Electricity, Power Generation & IT Exhibition
Every year
14-15 October 2026
Electrical, Energy, Lighting and Installation Technologies Trade Fair
Every year
17-19 February 2027
International Automotive Technologies and Mobility Exhibition
Every year
17-19 February 2027
International Automotive Electronics Technology Expo
Every year
17-19 February 2027
Automotive Components and Processing Technologies Expo
Every year
17-19 February 2027
International Cosmetics Development, Ingredients and Manufacturing Technologies...
Every year
17-19 February 2027
International Cosmetics and Beauty Products Trade Fair
Every year
17-19 February 2027
Cosmetics Marketing and Brand Development Expo
Every year
17-19 February 2027
Electronic Components and Materials Expo
Every year
17-19 February 2027
Electronics Testing, Measurement and Reliability Technologies Expo
Every year
17-19 February 2027
Electronics Manufacturing Services and ODM Expo
Every year
17-19 February 2027
Electric, Hybrid and Fuel Cell Vehicle Technologies Expo
IC & Sensor Packaging Expo is currently scheduled for 17-19 February 2027. If the programme changes, we will update the details here as well.
Yes. Choose “Visitor badge” in the request form and our team will get back to you with the available application and entry options for IC & Sensor Packaging Expo.
Yes. We can help plan your trip to IC & Sensor Packaging Expo, including hotels, flights, transfers and local assistance when needed.
Stand design, production and on-site operation requests are evaluated by fair and country. To clarify the right solution for IC & Sensor Packaging Expo, please contact us through our Contact page.
IC & Sensor Packaging Expo mainly serves the following sectors: Electrical and Electronics, Packaging, Plastic and Rubber Machinery and Technologies.
IC & Sensor Packaging Expo is held at Tokyo Big Sight · Tokyo · Japan. We recommend checking the latest hall and address details on the organiser's official website before you travel.
Featured topics for IC & Sensor Packaging Expo include: Electrical Engineering, Electricity, Electronic Packaging, Electronics, Machinery, Packaging Machinery, Plastics, Sensor Technology, Sensors.
Tour and travel options for IC & Sensor Packaging Expo
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