Bondexpo
International Adhesive Technology Exhibition
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6-8 October 2026 Completed
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When and where was Bondexpo held?
Bondexpo International Adhesive Technology Exhibition was held on 6-8 October 2026 at Messe Stuttgart in Germany - Stuttgart.
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Fair sectors
Organizer
Landesmesse Stuttgart GmbH & Co. KGBecome an Exhibitor
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Every year
3-4 March 2027
International Hydrogen and Fuel Cell Technology Exhibition
Every year
11-14 May 2027
International Quality Assurance Exhibition
Every two years
26-29 October 2027
International Sheet Metal Working Exhibition
Every two years
20-21 June 2028
Make-to-Order Manufacturing and Precision Parts Exhibition
Annually
22-24 June 2027
International Energy Storage Systems, Battery Technologies and Energy Managemen...
Every year
12-14 October 2027
International Power Transmission and Distribution Technology Exhibition
every 4 years
11-15 February 2028
International Culinary Arts and Gastronomy Exhibition
Every two years
2-4 March 2027
International Electrical, Energy and Building Technology Exhibition
Every year
16-18 March 2027
International Trade Show for Intralogistics Solutions and Process Management
Every year
15-18 April 2027
Future Homes and Sustainable Building Exhibition
Bondexpo was last held from 6-8 October 2026. The date of the next fair has not yet been announced.
Yes. You can send a request now to receive information about the available visitor badge options when the new date is announced.
Yes. Once the new date is announced, we can help plan your hotels, flights, transfers and local assistance when needed.
Yes. We can assess stand design, production and on-site support options for the next Bondexpo fair. Send your request through our Contact page.
Bondexpo mainly serves the following sectors: Machinery, Metalworking, Welding and Production Technologies, Chemical, Petrochemical and Natural Gas, Industry and Factory Automation.
Bondexpo was last held at Messe Stuttgart · Stuttgart · Germany. The location of the next fair will be confirmed with the organiser's new announcement.
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